Huawei Will Design High-End Kirin 1.4nm Chips by 2031

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Huawei is developing advanced smartphone chips using a new 1.4nm manufacturing process, aiming to lead the industry in chip technology. They plan to use this process for their Kirin chipsets, with the first 1.4nm chips expected by 2031.

Huawei has developed a new chip technology based on what’s known as the Tau Scaling Law. This allows them to achieve transistor densities comparable to those made using a 1.4nm process, which is very advanced. Currently, 3nm chips are the most common on the market, and Samsung is a leading manufacturer, utilizing a Gate-All-Around transistor design to create 3nm chips that offer both high performance and energy efficiency.

While 2nm technology exists, no products currently available to consumers use it. TSMC is developing this technology for commercial use, but it’s unclear when we’ll see it in actual devices.

HUAWEI is aiming to create even more advanced technology than what’s currently available. They’re doing this with a completely new chip design, similar to a technique called LogicFolding. This involves tightly packing incredibly small transistors – 1.4 nanometers in size – together using a unique process to significantly improve performance. Because of this new approach, the internal wiring within the chip will be shorter and redesigned, moving away from traditional wafer-based connections.

Physics shows that smaller nanometre-sized chips perform better, work faster, and use less energy. Huawei is working to create a new generation of chips based on this principle.

It’s still too soon to know exactly how well these chips will perform, so we’ll need to wait until 2031 to get a clear picture of their capabilities.

Huawei last year unveiled its new Kirin 5G chip, aiming to bring 5G connectivity to devices globally. Before this, they had only released one phone – the Mate 60 Pro – with their previous 5G chip. As a result, we might see new 5G devices from Huawei available as early as this year.

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2026-05-26 14:14